Thermal conductivity and tribological properties of POM-Cu composites

Authors

  • Junqing He,

    1. Key Laboratory for Ultrafine Materials of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, People's Republic of China
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  • Ling Zhang,

    1. Key Laboratory for Ultrafine Materials of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, People's Republic of China
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  • Chunzhong Li

    Corresponding author
    1. Key Laboratory for Ultrafine Materials of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, People's Republic of China
    • Key Laboratory for Ultrafine Materials of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, People's Republic of China
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Abstract

The polyoxymethylene (POM) composites with different copper contents were prepared by extrusion. The thermal conductivity and tribological behavior of POM-Cu composites with various contents of copper particles were investigated by a hot disk thermal analyzer and an M-2000 friction and abrasion testing machine, respectively. The effect of copper particles on the thermal conductivity of POM composites was negligible when copper content was below 10 wt %. As the copper content increased, the thermal conductivity of composites increased and reached 0.477 W m−1 K−1 for POM-25 wt % Cu composite, which increased by 35.9% compared with that of unfilled POM. The incorporation of copper particles into POM reduced the friction coefficient of POM composites. The wear mechanisms of POM-Cu composites were adhesive and abrasive wear. POLYM. ENG. SCI., 2010. © 2010 Society of Plastics Engineers

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