Polymer Engineering & Science

Cover image for Polymer Engineering & Science

March 1986

Volume 26, Issue 5

Pages fmi–fmi, 337–379

  1. Masthead

    1. Top of page
    2. Masthead
    3. Editorial
    4. Articles
    1. You have free access to this content
      Masthead (page fmi)

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760260501

  2. Editorial

    1. Top of page
    2. Masthead
    3. Editorial
    4. Articles
    1. You have free access to this content
      Guest editors' message (page 337)

      R. Bruce Prime and Zal N. Sanjana

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760260502

  3. Articles

    1. Top of page
    2. Masthead
    3. Editorial
    4. Articles
    1. Dynamic dielectric analysis: Nondestructive material evaluation and cure cycle monitoring (pages 338–345)

      D. Kranbuehl, S. Delos, E. Yi, J. Mayer, T. Jarvie, W. Winfree and T. Hou

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760260503

    2. Dielectric modeling of the curing process (pages 346–353)

      John W. Lane, James C. Seferis and Michael A. Bachmann

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760260504

    3. Chemical interpretation of the relaxed permittivity during epoxy resin cure (pages 354–357)

      Norman F. Sheppard Jr. and Stephen D. Senturia

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760260505

    4. Monitoring of laminate cure with microdielectrometry (pages 358–361)

      Wayne W. Bidstrup, Norman F. Sheppard Jr. and Stephen D. Senturia

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760260506

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