Polymer Engineering & Science

Cover image for Polymer Engineering & Science

March 1989

Volume 29, Issue 5

Pages fmi–fmi, 277–351

  1. Masthead

    1. Top of page
    2. Masthead
    3. Introduction
    4. Articles
    1. You have free access to this content
      Masthead (page fmi)

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760290501

  2. Introduction

    1. Top of page
    2. Masthead
    3. Introduction
    4. Articles
    1. Introduction (page 277)

      Sue Ann Bidstrup and R. Bruce Prime

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760290502

  3. Articles

    1. Top of page
    2. Masthead
    3. Introduction
    4. Articles
    1. Use of the frequency dependence of the impedance to monitor viscosity during cure (pages 285–289)

      D. Kranbuehl, S. Delos, M. Hoff, P. Haverty, W. Freeman, R. Hoffman and J. Godfrey

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760290504

    2. Monitoring the cure of a composite matrix resin with microdielectrometry (pages 290–294)

      Wayne W. Bidstrup and Stephen D. Senturia

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760290505

    3. Isothermal and temperature programmed kinetic studies of thermosets (pages 295–301)

      V. M. González-Romero and N. Casillas

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760290506

    4. Monitoring cure in sheet molding compound processing (pages 308–314)

      J. M. Castro and E. J. Straus

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760290508

    5. Dielectric analysis of the cure of thermosetting epoxy/amine systems (pages 325–328)

      Sue Ann Bidstrup, Norman F. Sheppard Jr. and Stephen D. Senturia

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760290510

    6. Viscosity modeling during epoxy resin cure (pages 329–333)

      George Schmitt, John Wiley and Jeffrey Gotro

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760290511

    7. Evaluation of dielectric cure models for an epoxy-amine resin system (pages 339–346)

      John W. Lane, Rangin K. Khattak and Mark R. Dusi

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760290513

    8. Curing of polyimides (pages 347–351)

      Claudius Feger

      Version of Record online: 25 AUG 2004 | DOI: 10.1002/pen.760290514

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