Polymer Engineering & Science

Cover image for Polymer Engineering & Science

May 1992

Volume 32, Issue 10

Pages fmi–fmi, 641–704

  1. Masthead

    1. Top of page
    2. Masthead
    3. Articles
    1. You have free access to this content
      Masthead (page fmi)

      Version of Record online: 26 AUG 2004 | DOI: 10.1002/pen.760321001

  2. Articles

    1. Top of page
    2. Masthead
    3. Articles
    1. Compressional behavior of inked open-cell foams (pages 668–677)

      J. C. Phillips and J. Auslander

      Version of Record online: 26 AUG 2004 | DOI: 10.1002/pen.760321005

    2. A study of the residual microstress at the matrix interface in filled epoxy resins (pages 678–685)

      Hong-Bing Wang, Shan-Jun Li, Hong-Wei Zhou, Tong-Yin Yu and Xiao-Wei Jin

      Version of Record online: 26 AUG 2004 | DOI: 10.1002/pen.760321006

    3. Thermal shock resistance of flat plastic integrated circuit packages (pages 686–689)

      Yoshitsugu Kojima, Takashi Ohta, Mitsumasa Matsushita, Minoru Takahara and Toshio Kurauchi

      Version of Record online: 26 AUG 2004 | DOI: 10.1002/pen.760321007

    4. Computer simulation of thermoforming in complex shapes (pages 699–704)

      K. Kouba, O. Bartos and J. Vlachopoulos

      Version of Record online: 26 AUG 2004 | DOI: 10.1002/pen.760321009

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