• graphene oxide;
  • polyimide;
  • thermal conductivity;
  • coefficient of thermal expansion (CTE);
  • surface resistance


Polyimide (PI) nanocomposites with both enhanced thermal conductivity and dimensional stability were achieved by incorporating glycidyl methacrylate-grafted graphene oxide (g-GO) in the PI matrix. The PI/g-GO nanocomposites exhibited linear enhancement in thermal conductivity when the amount of incorporated g-GO was less than 10 wt%. With the addition of 10 wt% of g-GO to PI (PI/g-GO-10), the thermal conductivity increased to 0.81 W m−1 K−1 compared to 0.13 W m−1 K−1 for pure PI. Moreover, the PI/g-GO-10 composite exhibited a low coefficient of thermal expansion (CTE) of 29 ppm °C−1. The values of CTE and thermal conductivity continuously decreased and increased, respectively, as the g-GO content increased to 20 wt%. Combined with excellent thermal stability and high mechanical strength, the highly thermally conducting PI/g-GO-10 nanocomposite is a potential substrate material for modern flexible printed circuits requiring efficient heat transfer capability.