Relation between the adhesion strength and interfacial width for symmetric polystyrene bilayers

Authors

  • Kei-Ichi Akabori,

    1. Department of Applied Chemistry, Faculty of Engineering, Kyushu University,744 Motooka, Nishi-Ku, Fukuoka 819-0395, Japan
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  • Daisuke Baba,

    1. Department of Applied Chemistry, Faculty of Engineering, Kyushu University,744 Motooka, Nishi-Ku, Fukuoka 819-0395, Japan
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  • Kazuhiro Koguchi,

    1. Department of Applied Chemistry, Faculty of Engineering, Kyushu University,744 Motooka, Nishi-Ku, Fukuoka 819-0395, Japan
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  • Keiji Tanaka,

    Corresponding author
    1. Department of Applied Chemistry, Faculty of Engineering, Kyushu University,744 Motooka, Nishi-Ku, Fukuoka 819-0395, Japan
    • Department of Applied Chemistry, Faculty of Engineering, Kyushu University,744 Motooka, Nishi-Ku, Fukuoka 819-0395, Japan
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  • Toshihiko Nagamura

    Corresponding author
    1. Department of Applied Chemistry, Faculty of Engineering, Kyushu University,744 Motooka, Nishi-Ku, Fukuoka 819-0395, Japan
    • Department of Applied Chemistry, Faculty of Engineering, Kyushu University,744 Motooka, Nishi-Ku, Fukuoka 819-0395, Japan
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Abstract

Polystyrene (PS) bilayers were prepared and were adhered at a temperature between the surface and bulk glass-transition temperatures for a given time. Then, the interfacial adhesion strength (GL) was examined with a conventional lap-shear measurement. GL first increased with increasing adhesion time and then reached a constant value. This result implied that the segments moved across the interface, to a certain depth, even at a temperature below the bulk glass-transition temperature. To confirm this, the interfacial evolution for the PS/deuterated PS bilayers was examined with dynamic secondary-ion mass spectrometry. The GL value was linearly proportional to the thickness of the interfacial adhesion layer. Finally, we propose a strategy for regulating the adhesion strength based on the chain-end chemistry. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3598–3604, 2006

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