A polyimide supported gold interconnect is one of the major candidates for realization of stretchable and curvilinear electronics featuring high reliability and biocompatibility. As presented by A. Jahanshahi, P. Salvo, and J. Vanfleteren on page 773, the track stress under elongation can be minimized by decreasing the track width, while multiple tracks can be fabricated parallel to each other to prevent high resistance. Four 20-lm-wide polyimide supported gold tracks are patterned in a horseshoe design on top of a commercial copper foil. These tracks can withstand 200,000 cycles of 30% elongation without any resistance variation. Various maximum elongations and maximum stress levels can be conveniently achieved by changing themeander design parameters.