Get access

Chemical and Physical Sputtering of Polyethylene Terephthalate (PET)

Authors

  • Simon Große-Kreul,

    1. Research Group Reactive Plasmas, Institute for Experimental Physics II, Ruhr-Universität Bochum, D-44780 Bochum, Germany
    Search for more papers by this author
  • Carles Corbella,

    1. Research Group Reactive Plasmas, Institute for Experimental Physics II, Ruhr-Universität Bochum, D-44780 Bochum, Germany
    Search for more papers by this author
  • Achim von Keudell

    Corresponding author
    1. Research Group Reactive Plasmas, Institute for Experimental Physics II, Ruhr-Universität Bochum, D-44780 Bochum, Germany
    • Research Group Reactive Plasmas, Institute for Experimental Physics II, Ruhr-Universität Bochum, D-44780 Bochum, Germany
    Search for more papers by this author

Abstract

The polymer polyethylene terephthalate (PET) has been exposed to quantified beams of argon ions and oxygen atoms and molecules. The etch rate (ER) and the surface composition of PET thin films have been analyzed by real time in situ Fourier transform infrared spectroscopy (FTIR). After the onset of the exposure of PET to the ion beam, the ER decreases rapidly by one order of magnitude irrespective of the ion energy. This slowing down of the ER is caused by cross-linking of the polymer surface. The steady state etch yields are generally orders of magnitude higher than predicted by computer calculations. The addition of oxygen to the particle flux is only changing the surface composition. At low ion energies, chemical sputtering dominates causing very high sputter yields. In addition, no threshold ion energy is observed.

original image

Ancillary