Plasma Process. Polym. 11–12/2012
Michael Thomas, Jochen Borris, Antje Dohse, Marko Eichler, Alena Hinze, Kristina Lachmann, Krees Nagel and Claus-Peter Klages
Version of Record online: 4 DEC 2012 | DOI: 10.1002/ppap.201290031
Cover: Local plasma treatment at atmospheric pressure of a 100 mm diameter silicon wafer carrying a wet-chemically etched topography with a height difference of 50 μm between recessed and elevated areas. Further details can be found in the article by Thomas et. al. on page 1086.