Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits
Article first published online: 20 MAR 2008
Copyright © 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
physica status solidi (a)
Volume 205, Issue 4, pages 922–926, April 2008
How to Cite
Rudra, S., Wächtler, T., Friedrich, M., Louis, S. J., Himcinschi, C., Zimmermann, S., Schulz, S. E., Silaghi, S., Cobet, C., Esser, N., Gessner, T. and Zahn, D. R. T. (2008), Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits. Phys. Status Solidi A, 205: 922–926. doi: 10.1002/pssa.200777831
- Issue published online: 4 APR 2008
- Article first published online: 20 MAR 2008
- Manuscript Accepted: 17 DEC 2007
- Manuscript Revised: 8 DEC 2007
- Manuscript Received: 11 JUN 2007
- German research foundation (DFG)
- BMBF. Grant Numbers: 05 KS4KTB/3, 05 ES3XBA/5
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