As shown by Tang et al. (pp. 2913-2919), a Pb(Zr,Ti)O3 (PZT) thick film with excellent properties can be fabricated by lapping bulk PZT after bonding it to a silicon wafer at 105 °C by employing epoxy resin with preferable thermostability as the intermediate adhesive layer. Based on this technique, a piezoelectric generator for micro-electro-mechanical systems (MEMS) technology was fabricated and its performance was tested. The results show that the new thick-film preparation method is compatible with MEMS technology and the PZT thick film retains the excellent performance of bulk PZT. This method provides a new way for the preparation of high performance piezoelectric MEMS energy harvesting elements.