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Solid-state dewetting for fabrication of metallic nanoparticles and influences of nanostructured substrates and dealloying

Authors

  • Dong Wang,

    Corresponding author
    • Chair Materials for Electronics, Institute of Materials Engineering and Institute of Micro- and Nanotechnologies MacroNano®, Ilmenau University of Technology, Ilmenau, Germany
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  • Peter Schaaf

    1. Chair Materials for Electronics, Institute of Materials Engineering and Institute of Micro- and Nanotechnologies MacroNano®, Ilmenau University of Technology, Ilmenau, Germany
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Corresponding author: e-mail dong.wang@tu-ilmenau.de, Phone: +49 3677 69 3170, Fax: +49 3677 69 3171

e-mail peter.schaaf@tu-ilmenau.de, Phone: +49 3677 69 3611, Fax: +49 3677 69 3171

Abstract

Solid-state dewetting of thin metallic films deposited on an inert substrate is considered as a simple method for the fabrication of metal nanoparticles and alloy nanoparticles. By combining other processes such as nanolithography and dealloying, ordered arrangements or complex arrangements of nanoparticles can be realized as well. The driving force for dewetting is the reduction of the surface energy and the interface energy between film and substrate. It occurs via diffusion even in the solid state at the temperature well below the melting point of the metal films. However, the mechanisms of solid-state dewetting are more complicated than those of liquid-state dewetting due to the interplay with additional processes, like grain growth, texture evolution, faceting (anisotropic diffusion), evaporation, and even alloying. Dewetting of metallic bilayers with two different types of metals can also serve as a simple method to investigate the alloying behavior in the nanoscale.

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