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1-3 ceramic/polymer composites for high-temperature transducer applications

Authors

  • Lili Li,

    1. Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education, International Center for Dielectric Research, Xi'an Jiaotong University, Xi'an, P. R. China
    2. Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, USA
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  • Shujun Zhang,

    Corresponding author
    1. Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, USA
    • Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education, International Center for Dielectric Research, Xi'an Jiaotong University, Xi'an, P. R. China
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  • Zhuo Xu,

    1. Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education, International Center for Dielectric Research, Xi'an Jiaotong University, Xi'an, P. R. China
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  • Xuecang Geng,

    1. Blatek Inc., State College, Pennsylvania, USA
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  • Thomas R. Shrout

    1. Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, USA
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Corresponding author: e-mail soz1@psu.edu, Phone: +814 863 2639, Fax: +814 865 7173

Abstract

1-3 ceramic/polymer composites based on high Curie temperature ferroelectric ceramic BiScO3–PbTiO3 (BSPT) were fabricated using the dice and fill method. The electromechanical coupling factor kt of BSPT composite was found to be 58% at room temperature, higher than the thickness coupling factor of monolithic BSPT ∼50%. In addition, BSPT 1-3 composite exhibits high thermal stability of electromechanical properties and low dielectric loss up to 300 °C, making it a potential candidate for broad-bandwidth transducer applications at elevated temperatures.

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