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Keywords:

  • crystal ion slicing;
  • lithium niobate;
  • thin films;
  • wafer bonding

The fabrication of LiNbO3 waveguide slabs with sub-micron thickness is presented using He ion-induced splitting and the Cu–Sn bonding technique. The exfoliation time of implanted LiNbO3 was investigated as a function of annealing temperatures to reveal the activation energies during the splitting process. Defect-free waveguide films with large areas of several cm2 are consistently produced by using the inter-diffusion bonding of Cu–Sn interface. The fabricated film was investigated by using the Rutherford backscattering/channeling method and dark mode spectroscopy.