Rapid Research Letter

Patterned deposition by plasma enhanced spatial atomic layer deposition

  1. Paul Poodt1,*,
  2. Bas Kniknie1,
  3. Annalisa Branca1,
  4. Hans Winands1,
  5. Fred Roozeboom1,2

Article first published online: 30 MAR 2011

DOI: 10.1002/pssr.201004542

Issue

physica status solidi (RRL) - Rapid Research Letters

physica status solidi (RRL) - Rapid Research Letters

Volume 5, Issue 4, pages 165–167, April 2011

Additional Information

How to Cite

Poodt, P., Kniknie, B., Branca, A., Winands, H. and Roozeboom, F. (2011), Patterned deposition by plasma enhanced spatial atomic layer deposition. Phys. Status Solidi RRL, 5: 165–167. doi: 10.1002/pssr.201004542

Author Information

  1. 1

    TNO, PO Box 6235, 5600 HE Eindhoven, The Netherlands

  2. 2

    Eindhoven University of Technology, Dept. of Applied Physics, PO Box 513, 5600 MB Eindhoven, The Netherlands

*Phone: +31 888 665 630, Fax: +31 402 560 850

Publication History

  1. Issue published online: 12 APR 2011
  2. Article first published online: 30 MAR 2011
  3. Manuscript Accepted: 29 MAR 2011
  4. Manuscript Revised: 28 MAR 2011
  5. Manuscript Received: 28 DEC 2010

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Keywords:

  • atomic layer deposition;
  • plasma-enhanced deposition;
  • patterning;
  • alumina

Abstract

An atmospheric pressure plasma enhanced atomic layer deposition reactor has been developed, to deposit Al2O3 films from trimethyl aluminum and an He/O2 plasma. This technique can be used for 2D patterned deposition in a single in-line process by making use of switched localized plasma sources. It was observed that the sharpness of the patterns is primarily influenced by the concentration of reactive plasma species and by the dimensions of the plasma source. (© 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

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