Organic thin-film transistor fabricated between flexible films by thermal lamination (pages 1093–1096)
M. Sakai, T. Okamoto, Y. Yamazaki, J. Hayashi, S. Yamaguchi, S. Kuniyoshi, H. Yamauchi, Y. Sadamitsu, M. Hamada and K. Kudo
Article first published online: 20 SEP 2013 | DOI: 10.1002/pssr.201308118
In the future, flexible sheet electronics could be fabricated using a toner-based method, such as Xerox or laser printing, followed by a lamination.The lamination process is a solvent-free, material-saving, and low-temperature process for flexible card or sheet electronics. The results of the present research phase, using a desktop laminator, will soon be expandable to large-scale and high-throughput industrial manufacturing processes.