The realization of memory devices on various unconventional substrates has been made possible by use of the transfer printing technique. The memory devices have been fabricated onto a range of unconventional substrates including paper, an insect (cicada), glass, polyethersulphone, polyimide, double-sided tape, Al foil, fabric, a mask, a leather wallet, a name card, a banknote, a latex glove, and a squeezed plastic bottle. In their Letter on pp. 326–331 Choi et al. show that the constraints imposed by process compatibility between the substrates and the device materials are completely eliminated by the use of the transfer printing technique. It is confirmed that the electrical characteristics of the RRAM devices do not degrade during the transfer process. Stable resistive switching properties, reliable endurance levels, and good retention characteristics are demonstrated. The mechanical stability is also analysed and an encapsulation protection layer on top of the memory devices is suggested for long-term reliability. The possibility of the realization of integrated electronic systems onto various substrates will enable the versatile use of these electronics anywhere and anytime in many different environments.