Interfacial reactions of nickel ion containing multilayers and nickel ultra-thin films with an interpenetrating polymer network substrate



An interpenetrating polymer network (IPN) substrate was prepared by dip-pulling a silicon wafer or glass plate into polymer precursors, followed by solidification at room temperature. The nickel ion containing Langmuir–Blodgett (LB) multilayers was subsequently fabricated onto the IPN substrate by a LB technique, and then the nickel ultra-thin films were deposited by chemical reduction. The interfacial reactions, the metal transformations and the non-metal bond types during the film formation were detected by the X-ray photoelectron spectroscopy, atomic force microscope and attenuated total reflection infrared spectroscopy. Copyright © 2011 John Wiley & Sons, Ltd.