This work was supported by the Australian Research Council, the Australian Government, the US Advanced Research and Development Activity, National Security Agency, and Army Research Office under contract DAAD19-01-1-0653, and the Semiconductor Research Corporation (SRC). M.Y.S. acknowledges an Australian Government Federation Fellowship. F.J.R. acknowledges 3D graphics support from H. Holzapfel at www.ScienceImage.eu.
Communication
Realization of Atomically Controlled Dopant Devices in Silicon†
Article first published online: 6 MAR 2007
DOI: 10.1002/smll.200600680
Copyright © 2007 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Additional Information
How to Cite
Rueß, F., Pok, W., Reusch, T. C., Butcher, M., Goh, K. E., Oberbeck, L., Scappucci, G., Hamilton, A. and Simmons, M. (2007), Realization of Atomically Controlled Dopant Devices in Silicon. Small, 3: 563–567. doi: 10.1002/smll.200600680
- †
Publication History
- Issue published online: 22 MAR 2007
- Article first published online: 6 MAR 2007
- Manuscript Received: 2 DEC 2006
- Abstract
- Article
- References
- Cited By
Keywords:
- doping;
- molecular beam epitaxy;
- nanostructures;
- scanning probe microscopy;
- silicon
Graphical Abstract

Molecular beam epitaxy and scanning tunneling microscopy (STM) patterning are combined to form highly doped, planar devices in silicon at the atomic level. The absolute device location is registered to microscopic markers (see image; scale bar: 50 μm) for the alignment of surface contacts, enabling the correlation of the electrical properties of atomically controlled devices such as nanowires, tunnel junctions, and nanodots to the dopant location, monitored using high-resolution STM techniques.

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