Full Paper
A Chemically Amplified Fullerene-Derivative Molecular Electron-Beam Resist
Article first published online: 15 NOV 2007
DOI: 10.1002/smll.200700324
Copyright © 2007 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Additional Information
How to Cite
Gibbons, F., Zaid, Hasnah M., Manickam, M., Preece, Jon A., Palmer, Richard E. and Robinson, A. P. G. (2007), A Chemically Amplified Fullerene-Derivative Molecular Electron-Beam Resist. Small, 3: 2076–2080. doi: 10.1002/smll.200700324
Publication History
- Issue published online: 4 DEC 2007
- Article first published online: 15 NOV 2007
- Manuscript Received: 10 MAY 2007
- Abstract
- Article
- References
- Cited By
Keywords:
- chemical amplification;
- electron beams;
- fullerenes;
- lithography;
- resists
Abstract
Current lithographic resists depend on large polymeric materials, which are starting to limit further improvements in line-width roughness and feature size. Fullerene molecular resists use much smaller molecules to avoid this problem. However, such resists have poor radiation sensitivity. Chemical amplification of a fullerene derivative using an epoxy crosslinker and a photoacid generator is demonstrated. The sensitivity of the material is increased by two orders of magnitude, and 20-nm line widths are patterned.

1613-6829/asset/olbannerleft.gif?v=1&s=abb62bf4c508cccceaedd2e443743ab301acf753)
1613-6829/asset/olbannerright.gif?v=1&s=a0928f6da005e96a3ecfdb9f725fca70c1592474)
