These authors contributed equally to this work.
Nanostructured Copper Interfaces for Enhanced Boiling†
Article first published online: 23 JUN 2008
Copyright © 2008 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim
Volume 4, Issue 8, pages 1084–1088, August 2008
How to Cite
Li, C., Wang, Z., Wang, P.-I., Peles, Y., Koratkar, N. and Peterson, G. P. (2008), Nanostructured Copper Interfaces for Enhanced Boiling. Small, 4: 1084–1088. doi: 10.1002/smll.200700991
The authors acknowledge the support of the National Science Foundation under award CEBT-0721246 to G.P.P. and awards ECS 0403789 and ECS 0506738 to N.K.
- Issue published online: 31 JUL 2008
- Article first published online: 23 JUN 2008
- Manuscript Received: 17 OCT 2007
- heat transfer;
- nucleate boiling
On the boil: Nanostructured Cu interfaces display enhanced boiling performance at low superheated temperatures compared to untreated Cu, caused by a large increase in the density of active bubble nucleation sites. The enhancement is caused by nanobubbles, which percolate through the interconnected network of nanopores and enable stable nucleation of bubbles at microscale cavities (defects) on the film surface (see picture).