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Communication

Nanostructured Copper Interfaces for Enhanced Boiling†

  1. Chen Li2,‡,
  2. Zuankai Wang1,‡,
  3. Pei-I Wang3,
  4. Yoav Peles1,
  5. Nikhil Koratkar1,*,
  6. G. P. Peterson2,*

Article first published online: 23 JUN 2008

DOI: 10.1002/smll.200700991

Issue

Small

Small

Volume 4, Issue 8, pages 1084–1088, August 2008

Additional Information

How to Cite

Li, C., Wang, Z., Wang, P.-I., Peles, Y., Koratkar, N. and Peterson, G. P. (2008), Nanostructured Copper Interfaces for Enhanced Boiling. Small, 4: 1084–1088. doi: 10.1002/smll.200700991

Author Information

  1. 1

    Department of Mechanical, Aerospace, and Nuclear Engineering Rensselaer Polytechnic Institute Troy, NY 12180 (USA)

  2. 2

    Department of Mechanical Engineering University of Colorado Boulder, CO 80309 (USA)

  3. 3

    Department of Physics, Applied Physics, and Astronomy Rensselaer Polytechnic Institute Troy, NY 12180 (USA)

  1. ‡

    These authors contributed equally to this work.

*Department of Mechanical, Aerospace, and Nuclear Engineering Rensselaer Polytechnic Institute Troy, NY 12180 (USA).

  1. †

    The authors acknowledge the support of the National Science Foundation under award CEBT-0721246 to G.P.P. and awards ECS 0403789 and ECS 0506738 to N.K.

  2. ‡

    These authors contributed equally to this work.

Publication History

  1. Issue published online: 31 JUL 2008
  2. Article first published online: 23 JUN 2008
  3. Manuscript Received: 17 OCT 2007

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Keywords:

  • copper;
  • heat transfer;
  • interfaces;
  • nanorods;
  • nucleate boiling
Thumbnail image of graphical abstract

On the boil: Nanostructured Cu interfaces display enhanced boiling performance at low superheated temperatures compared to untreated Cu, caused by a large increase in the density of active bubble nucleation sites. The enhancement is caused by nanobubbles, which percolate through the interconnected network of nanopores and enable stable nucleation of bubbles at microscale cavities (defects) on the film surface (see picture).

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