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Nanostructured Copper Interfaces for Enhanced Boiling

Authors

  • Chen Li,

    1. Department of Mechanical Engineering University of Colorado Boulder, CO 80309 (USA)
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    • These authors contributed equally to this work.

  • Zuankai Wang,

    1. Department of Mechanical, Aerospace, and Nuclear Engineering Rensselaer Polytechnic Institute Troy, NY 12180 (USA)
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    • These authors contributed equally to this work.

  • Pei-I Wang,

    1. Department of Physics, Applied Physics, and Astronomy Rensselaer Polytechnic Institute Troy, NY 12180 (USA)
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  • Yoav Peles,

    1. Department of Mechanical, Aerospace, and Nuclear Engineering Rensselaer Polytechnic Institute Troy, NY 12180 (USA)
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  • Nikhil Koratkar,

    Corresponding author
    1. Department of Mechanical, Aerospace, and Nuclear Engineering Rensselaer Polytechnic Institute Troy, NY 12180 (USA)
    • Department of Mechanical, Aerospace, and Nuclear Engineering Rensselaer Polytechnic Institute Troy, NY 12180 (USA).
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  • G. P. Peterson

    Corresponding author
    1. Department of Mechanical Engineering University of Colorado Boulder, CO 80309 (USA)
    • Department of Mechanical Engineering University of Colorado Boulder, CO 80309 (USA).
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  • The authors acknowledge the support of the National Science Foundation under award CEBT-0721246 to G.P.P. and awards ECS 0403789 and ECS 0506738 to N.K.

Abstract

original image

On the boil: Nanostructured Cu interfaces display enhanced boiling performance at low superheated temperatures compared to untreated Cu, caused by a large increase in the density of active bubble nucleation sites. The enhancement is caused by nanobubbles, which percolate through the interconnected network of nanopores and enable stable nucleation of bubbles at microscale cavities (defects) on the film surface (see picture).

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