Communication

Nanostructured Copper Interfaces for Enhanced Boiling†

  1. Chen Li2,‡,
  2. Zuankai Wang1,‡,
  3. Pei-I Wang3,
  4. Yoav Peles1,
  5. Nikhil Koratkar1,*,
  6. G. P. Peterson2,*

Article first published online: 23 JUN 2008

DOI: 10.1002/smll.200700991

Issue

Small

Small

Volume 4, Issue 8, pages 1084–1088, August 2008

Additional Information

How to Cite

Li, C., Wang, Z., Wang, P.-I., Peles, Y., Koratkar, N. and Peterson, G. P. (2008), Nanostructured Copper Interfaces for Enhanced Boiling. Small, 4: 1084–1088. doi: 10.1002/smll.200700991

Author Information

  1. 1

    Department of Mechanical, Aerospace, and Nuclear Engineering Rensselaer Polytechnic Institute Troy, NY 12180 (USA)

  2. 2

    Department of Mechanical Engineering University of Colorado Boulder, CO 80309 (USA)

  3. 3

    Department of Physics, Applied Physics, and Astronomy Rensselaer Polytechnic Institute Troy, NY 12180 (USA)

  1. ‡

    These authors contributed equally to this work.

*Department of Mechanical, Aerospace, and Nuclear Engineering Rensselaer Polytechnic Institute Troy, NY 12180 (USA).

  1. †

    The authors acknowledge the support of the National Science Foundation under award CEBT-0721246 to G.P.P. and awards ECS 0403789 and ECS 0506738 to N.K.

  2. ‡

    These authors contributed equally to this work.

Publication History

  1. Issue published online: 31 JUL 2008
  2. Article first published online: 23 JUN 2008
  3. Manuscript Received: 17 OCT 2007

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