These authors contributed equally.
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Communication
Polyethylene Glycol as a Novel Resist and Sacrificial Material for Generating Positive and Negative Nanostructures†
Article first published online: 18 JUN 2008
DOI: 10.1002/smll.200701089
Copyright © 2008 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim
Additional Information
How to Cite
Sanedrin, R. G., Huang, L., Jang, J.-W., Kakkassery, J. and Mirkin, C. A. (2008), Polyethylene Glycol as a Novel Resist and Sacrificial Material for Generating Positive and Negative Nanostructures. Small, 4: 920–924. doi: 10.1002/smll.200701089
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C. A. M. acknowledges DARPA, AFSOR, NSF, NSEC, and NCI (through the CCNE program) for support of the research. He is also grateful for a NIH Director's Pioneer Award.
- ‡
These authors contributed equally.
Publication History
- Issue published online: 11 JUL 2008
- Article first published online: 18 JUN 2008
- Manuscript Revised: 24 JAN 2008
- Manuscript Received: 9 NOV 2007
Keywords:
- dip-pen nanolithography;
- nanostructures;
- polyethylene glycol;
- resists;
- wet chemical etching
One material for two purposes: Poly(ethylene glycol) is used as a novel etch resist to generate both raised and recessed nanoscale solid-state structures (see image). This novel resist is inexpensive, easy to use, and affords sub-100-nm resolution.