This work was supported by grants from the Arnold and Mabel Beckman Foundation, the Camille-Dreyfus Foundation, and the National Science Foundation (Career-DMMI 044816). We thank Aasiyeh Zarafshar and Anum Azam for their artistic contribution.
Thin Film Stress Driven Self-Folding of Microstructured Containers†
Article first published online: 14 AUG 2008
Copyright © 2008 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim
Volume 4, Issue 10, pages 1605–1609, October 2008
How to Cite
Leong, T. G., Benson, B. R., Call, E. K. and Gracias, D. H. (2008), Thin Film Stress Driven Self-Folding of Microstructured Containers. Small, 4: 1605–1609. doi: 10.1002/smll.200800280
- Issue published online: 9 OCT 2008
- Article first published online: 14 AUG 2008
- Manuscript Revised: 23 MAY 2008
- Manuscript Received: 25 FEB 2008
- Arnold and Mabel Beckman Foundation
- Camille-Dreyfus Foundation
- National Science Foundation. Grant Number: Career-DMMI 044816
- thin-film stress
Tiny boxes: A highly parallel, low-temperature process allows the self-assembly of hollow, cubic microcontainers with patterned faces that can encapsulate objects within. The process is based on the self-folding of lithographically patterned cruciforms and exploits stress inherent in thermally evaporated thin films to drive the assembly of the microstructures, which are on the order of 50–500 µm. The assembly occurs in water at 40–60 °C.