We acknowledge support from the NSF-supported NIRT (CTS-0609107), the Materials Research Science and Engineering Center on Polymers (DME-0213695), the Center for UMass/Industry Research on Polymers, and NSF grants DMR-0306951, DMI-0103024 and CHE 0518487. ADD gratefully acknowledges support from the Research Corporation Cottrell Scholarship Program and a UMass Faculty Research Grant.
Self-Assembled Electrical Contact to Nanoparticles Using Metallic Droplets†
Article first published online: 22 MAY 2009
Copyright © 2009 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim
Volume 5, Issue 17, pages 1974–1977, September 4, 2009
How to Cite
Du, K., Knutson, C. R., Glogowski, E., McCarthy, K. D., Shenhar, R., Rotello, V. M., Tuominen, M. T., Emrick, T., Russell, T. P. and Dinsmore, A. D. (2009), Self-Assembled Electrical Contact to Nanoparticles Using Metallic Droplets. Small, 5: 1974–1977. doi: 10.1002/smll.200900203
- Issue published online: 26 AUG 2009
- Article first published online: 22 MAY 2009
- Manuscript Received: 4 FEB 2009
- NSF. Grant Numbers: DMR-0306951, DMI-0103024, CHE 0518487
- Coulomb blockade;
- liquid metals;
Self-assembly of nanoparticles on liquid-metal droplets (see image) provides a simple, effective approach to electronic devices with nanoscale control of the metal/nanoparticle junctions. This approach enables the inexpensive fabrication of a large number of devices and deposition on large-area substrates.