Directed Fracture for the Fabrication of Free-Standing Multilayered Submicrometer Structures

Authors

  • Roberto R. Robaina,

    1. Institut de Microelectrònica de Barcelona, IMB-CNM (CSIC), Campus UAB, 08193 Cerdanyola, Barcelona, Spain
    Current affiliation:
    1. Current address: Centro de Investigaciones en Microelectrónica (CIME), 10800 Havana, Cuba
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  • María José López-Martínez,

    1. Institut de Microelectrònica de Barcelona, IMB-CNM (CSIC), Campus UAB, 08193 Cerdanyola, Barcelona, Spain
    Current affiliation:
    1. Current address: University of Groningen, 9700 AD Groningen, The Netherlands
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  • Jaume Esteve,

    1. Institut de Microelectrònica de Barcelona, IMB-CNM (CSIC), Campus UAB, 08193 Cerdanyola, Barcelona, Spain
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  • Raquel Perez-Castillejos,

    Corresponding author
    1. New Jersey Institute of Technology (NJIT), 323 Martin Luther King Jr Blvd. (NJIT), Newark, NJ 07102, USA
    • New Jersey Institute of Technology (NJIT), 323 Martin Luther King Jr Blvd. (NJIT), Newark, NJ 07102, USA.
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  • José Antonio Plaza

    Corresponding author
    1. Institut de Microelectrònica de Barcelona, IMB-CNM (CSIC), Campus UAB, 08193 Cerdanyola, Barcelona, Spain
    • Institut de Microelectrònica de Barcelona, IMB-CNM (CSIC), Campus UAB, 08193 Cerdanyola, Barcelona, Spain
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Abstract

original image

Microdevices are fractured at specific sites to fabricate free-standing multilayered submicrometer structures, which consist of the microdevice cross sections that become exposed after fracture. As determined by finite-element modeling, the microdevices feature a fracturing point where stress concentrates under applied pulling forces. The structures fabricated here have a core of phosphosilicate glass surrounded by a layer of polycrystalline silicon.

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