An Effective Lift-Off Method for Patterning High-Density Gold Interconnects on an Elastomeric Substrate
Article first published online: 22 NOV 2010
Copyright © 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Volume 6, Issue 24, pages 2847–2852, December 20, 2010
How to Cite
Guo, L. and DeWeerth, S. P. (2010), An Effective Lift-Off Method for Patterning High-Density Gold Interconnects on an Elastomeric Substrate. Small, 6: 2847–2852. doi: 10.1002/smll.201001456
- Issue published online: 14 DEC 2010
- Article first published online: 22 NOV 2010
- Manuscript Revised: 8 SEP 2010
- Manuscript Received: 8 AUG 2010
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