In continuing the steady development of integrated-circuit-related fabrication, the ability to pattern conducting polymers into smaller and smaller sizes in order to realize devices with enhanced performance or even wholly new properties begins to take a more prominent role in their advanced applications. This review summarizes the recent advances in top-down and bottom-up patterning of conducting polymers on surfaces with different approaches including direct writing, in-situ synthesis or assembly, etching, and nanoscratching. All of the latest emerging strategies have the potential to go beyond the current state of the art towards real progress in terms of high-precision positioning, high resolution, high throughout, higher stability, facile processing, and lower-cost production.
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