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Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration

Authors

  • Teng Wang,

    1. Department of Microtechnology and Nanoscience (MC2) Chalmers University of Technology 412 96 Göteborg, Sweden
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  • Kejll Jeppson,

    1. Department of Microtechnology and Nanoscience (MC2) Chalmers University of Technology 412 96 Göteborg, Sweden
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  • Lilei Ye,

    1. SHT Smart High-Tech AB Fysikgränd 3, 412 96 Göteborg, Sweden
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  • Johan Liu

    Corresponding author
    1. Department of Microtechnology and Nanoscience (MC2) Chalmers University of Technology 412 96 Göteborg, Sweden
    2. Key Laboratory of New Displays and System Applications and SMIT Center School of Mechanical Engineering and Automation Shanghai University Box 282, No. 149 Yanchang Road, 200072 Shanghai, China
    • Department of Microtechnology and Nanoscience (MC2) Chalmers University of Technology 412 96 Göteborg, Sweden.
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Abstract

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Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT and CNT-to-Au contacts are realized at the microscale, and their specific contact resistances extracted from electrical measurements are approximately 1.2 × 10−3 Ω cm2 and 4.5 × 10−4 Ω cm2, respectively.

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