One-Dimensional Nano-Interconnection Formation

Authors

  • Jianlong Ji,

    1. MicroNano System Research Center, College of Information Engineering, Taiyuan University of Technology, Taiyuan, 030024, PR China
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  • Zhaoying Zhou,

    Corresponding author
    1. MEMS Laboratory, Department of Precision Instruments and Mechanolog, Tsinghua University, Beijing, 10084 , PR China
    • MEMS Laboratory, Department of Precision Instruments and Mechanolog, Tsinghua University, Beijing, 10084 , PR China
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  • Xing Yang,

    Corresponding author
    1. MEMS Laboratory, Department of Precision Instruments and Mechanolog, Tsinghua University, Beijing, 10084 , PR China
    • MEMS Laboratory, Department of Precision Instruments and Mechanolog, Tsinghua University, Beijing, 10084 , PR China
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  • Wendong Zhang,

    Corresponding author
    1. MicroNano System Research Center, College of Information Engineering, Taiyuan University of Technology, Taiyuan, 030024, PR China
    • MicroNano System Research Center, College of Information Engineering, Taiyuan University of Technology, Taiyuan, 030024, PR China.
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  • Shengbo Sang,

    1. MicroNano System Research Center, College of Information Engineering, Taiyuan University of Technology, Taiyuan, 030024, PR China
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  • Pengwei Li

    1. MicroNano System Research Center, College of Information Engineering, Taiyuan University of Technology, Taiyuan, 030024, PR China
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Abstract

Interconnection of one-dimensional nanomaterials such as nanowires and carbon nanotubes with other parts or components is crucial for nanodevices to realize electrical contacts and mechanical fixings. Interconnection has been being gradually paid great attention since it is as significant as nanomaterials properties, and determines nanodevices performance in some cases. This paper provides an overview of recent progress on techniques that are commonly used for one-dimensional interconnection formation. In this review, these techniques could be categorized into two different types: two-step and one-step methods according to their established process. The two-step method is constituted by assembly and pinning processes, while the one-step method is a direct formation process of nano-interconnections. In both methods, the electrodeposition approach is illustrated in detail, and its potential mechanism is emphasized.

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