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Thermal and Electrical Conduction in Ultrathin Metallic Films: 7 nm down to Sub-Nanometer Thickness

Authors

  • Huan Lin,

    1. 2010 Black Engineering Building, Department of Mechanical Engineering, Iowa State University, Ames, Iowa 50011, USA, Phone: (515) 294-2085, Fax: (515) 294-3261
    2. College of Engineering, Ocean University of China, Qingdao, Shandong, 266100, PR China
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  • Shen Xu,

    1. 2010 Black Engineering Building, Department of Mechanical Engineering, Iowa State University, Ames, Iowa 50011, USA, Phone: (515) 294-2085, Fax: (515) 294-3261
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  • Xinwei Wang,

    Corresponding author
    1. 2010 Black Engineering Building, Department of Mechanical Engineering, Iowa State University, Ames, Iowa 50011, USA, Phone: (515) 294-2085, Fax: (515) 294-3261
    • 2010 Black Engineering Building, Department of Mechanical Engineering, Iowa State University, Ames, Iowa 50011, USA, Phone: (515) 294-2085, Fax: (515) 294-3261.
    Search for more papers by this author
  • Ning Mei

    1. College of Engineering, Ocean University of China, Qingdao, Shandong, 266100, PR China
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Abstract

For ultrathin metallic films (e.g., less than 5 nm), no knowledge is yet available on how electron scattering at surface and grain boundaries reduces the electrical and thermal transport. The thermal and electrical conduction of metallic films is characterized down to 0.6 nm average thickness. The electrical and thermal conductivities of 0.6 nm Ir film are reduced by 82% and 50% from the respective bulk values. The Lorenz number is measured as 7.08 × 10−8 W Ω K−2, almost a twofold increase of the bulk value. The Mayadas-Shatzkes model is used to interpret the experimental results and reveals very strong electron reflection (>90%) at grain boundaries.

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