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Resistless Nanoimprinting in Metal for Plasmonic Nanostructures

Authors

  • Leo T. Varghese,

    1. Birck Nanotechnology Center and School of Electrical and Computer Engineering, Purdue University, Indiana 47907, USA
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  • Li Fan,

    1. Birck Nanotechnology Center and School of Electrical and Computer Engineering, Purdue University, Indiana 47907, USA
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  • Yi Xuan,

    Corresponding author
    1. Birck Nanotechnology Center and School of Electrical and Computer Engineering, Purdue University, Indiana 47907, USA
    • Birck Nanotechnology Center and School of Electrical and Computer Engineering, Purdue University, Indiana 47907, USA.

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  • Chookiat Tansarawiput,

    1. Birck Nanotechnology Center and School of Electrical and Computer Engineering, Purdue University, Indiana 47907, USA
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  • Sangsik Kim,

    1. Birck Nanotechnology Center and School of Electrical and Computer Engineering, Purdue University, Indiana 47907, USA
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  • Minghao Qi

    Corresponding author
    1. Birck Nanotechnology Center and School of Electrical and Computer Engineering, Purdue University, Indiana 47907, USA
    • Birck Nanotechnology Center and School of Electrical and Computer Engineering, Purdue University, Indiana 47907, USA.

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Abstract

Metal nanostructures are the main building blocks of metamaterials and plasmonics which show many extraordinary properties not existing in nature. A simple and widely applicable method that can directly pattern metals with silicon molds without the need of resists, using pressures of <4 MPa and temperatures of 25–150 °C is reported. Three-dimensional structures with smooth and vertical sidewalls, down to sub-10 nm resolution, are generated in silver and gold films in a single patterning step. Using this nanopatterning scheme, large-scale vivid images through extraordinary optical transmission and strong surface-enhanced Raman scattering substrates are realized. Resistless nanoimprinting in metal (RNIM) is a new class of metal patterning that allows plasmonic nanostructures to be fabricated quickly, repeatedly, and at a low-cost.

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