IEEJ Transactions on Electrical and Electronic Engineering

Cover image for Vol. 9 Issue 4

July 2014

Volume 9, Issue 4

Pages 343–458

  1. Papers

    1. Top of page
    2. Papers
    1. Microporous activated carbons from used coffee grounds for application to electric double-layer capacitors (pages 343–350)

      Daisuke Tashima, Yoshihiro Hamasuna, Daisuke Mishima, Seiji Kumagai and John D. W. Madden

      Article first published online: 18 JUN 2014 | DOI: 10.1002/tee.21978

    2. In-Air finger motion interface for mobile devices with vibration feedback (pages 375–383)

      Takehiro Niikura, Yoshihiro Watanabe, Takashi Komuro and Masatoshi Ishikawa

      Article first published online: 2 JUN 2014 | DOI: 10.1002/tee.21982

    3. Crosstalk analysis in CNT bundle interconnects for VLSI application (pages 391–397)

      Mayank Kumar Rai, Rajesh Khanna and Sankar Sarkar

      Article first published online: 18 JUN 2014 | DOI: 10.1002/tee.21984

    4. CPW-fed compact thin-film UWB antenna with dual band-notched characteristics (pages 421–426)

      Maleeya Tangjitjetsada, Paitoon Rakluea, Noppin Anantrasirichai, Chawalit Benjangkaprasert and Toshio Wakabayashi

      Article first published online: 27 MAY 2014 | DOI: 10.1002/tee.21988

    5. A behavioral model for optically powered OCT endoscope with a micro electrostatic vertical-comb optical scanner (pages 448–458)

      Muneki Nakada, Changho Chong, Atsushi Morosawa, Keiji Isamoto, Takuya Suzuki, Hiroyuki Fujita and Hiroshi Toshiyoshi

      Article first published online: 23 MAY 2014 | DOI: 10.1002/tee.21992