Mechanical characterizations of topology-insensitive rivet bonding using the sidewall bond principle
Article first published online: 27 DEC 2011
Copyright © 2011 Institute of Electrical Engineers of Japan
IEEJ Transactions on Electrical and Electronic Engineering
Volume 7, Issue 2, pages 111–115, March 2012
How to Cite
Kang, S., Lee, E., Kim, H. C. and Chun, K. (2012), Mechanical characterizations of topology-insensitive rivet bonding using the sidewall bond principle. IEEJ Trans Elec Electron Eng, 7: 111–115. doi: 10.1002/tee.20701
- Issue published online: 24 JAN 2012
- Article first published online: 27 DEC 2011
- Manuscript Revised: 4 AUG 2010
- Manuscript Received: 15 MAR 2010
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