Crack propagation and fracture in silicon wafers under thermal stress
© Andreas Danilewsky et al. 2013
Journal of Applied Crystallography
Volume 46, Issue 4, pages 849–855, August 2013
How to Cite
Danilewsky, A., Wittge, J., Kiefl, K., Allen, D., McNally, P., Garagorri, J., Elizalde, M. R., Baumbach, T. and Tanner, B. K. (2013), Crack propagation and fracture in silicon wafers under thermal stress. Jnl Applied Crystallography, 46: 849–855. doi: 10.1107/S0021889813003695
Movie showing X-ray diffraction images around a crack tip during heating. DOI: 10.1107/S0021889813003695/xz5004sup1.wmv
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