High-Speed Camera Investigation into Fracture Behavior of Solder Ball Joints Under Dynamic Loading

Authors

  • D.-S. Liu,

    1. Advanced Institute of Manufacturing for High-tech Innovations and Department of Mechanical Engineering, National Chung Cheng University, Chia-yi County, Taiwan
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  • C.-L. Hsu,

    Corresponding author
    1. Advanced Institute of Manufacturing for High-tech Innovations and Department of Mechanical Engineering, National Chung Cheng University, Chia-yi County, Taiwan
    • Correspondence

      C.-L. Hsu

      Advanced Institute of Manufacturing for High-tech Innovations and Department of Mechanical Engineering

      National Chung Cheng University,

      Chia-yi County,

      Taiwan

      Email: changlin0331@gmail.com

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  • C.-L. Chung

    1. Department of Materials Science and Engineering, I-Shou University, Kaohsiung City, Taiwan
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Abstract

The mechanical integrity of solder ball joints under dynamic loading is generally evaluated by means of a JEDEC standard impact test at high speed (0.01–1 m/s). Such tests result in a higher incidence of interfacial fracture than low-speed shear tests, and provide valuable insights into the load–displacement response and failure mode of the solder ball joint. This study proposes an experimental technique for observing the interfacial fracture phenomenon by means of a high-speed framing camera that captures approximately 500,000 frames per second (fps). It is shown that by selecting an appropriate frame rate (78,212 fps), the resulting sequence of images provides a useful understanding of the manner in which the fracture originates, propagates, and leads to various types of failure mode, such as interfacial and bulk solder cracks.

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