High-Speed Camera Investigation into Fracture Behavior of Solder Ball Joints Under Dynamic Loading
Article first published online: 15 MAY 2014
© 2014, Society for Experimental Mechanics
How to Cite
Liu, D.-S., Hsu, C.-L. and Chung, C.-L. (2014), High-Speed Camera Investigation into Fracture Behavior of Solder Ball Joints Under Dynamic Loading. Experimental Techniques. doi: 10.1111/ext.12101
- Article first published online: 15 MAY 2014
- Manuscript Accepted: 16 APR 2014
- Manuscript Revised: 15 APR 2014
- Manuscript Received: 12 APR 2013
- National Science Council, Taiwan. Grant Numbers: NSC 101-2221-E-194-014-MY3, NSC 101-2923-E-194-002-MY3
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