Member, American Ceramic Society.
Microstructure and Mechanical Properties of Hot-Pressed Silicon Carbide-Aluminum Nitride Compositions
Article first published online: 11 JUL 2005
DOI: 10.1111/j.1151-2916.1992.tb08182.x
Additional Information
How to Cite
Xu, Y., Zangvil, A., Landon, M. and Thevenot, F. (1992), Microstructure and Mechanical Properties of Hot-Pressed Silicon Carbide-Aluminum Nitride Compositions. Journal of the American Ceramic Society, 75: 325–333. doi: 10.1111/j.1151-2916.1992.tb08182.x
D. J. Green—contributing editor
- †
Member, American Ceramic Society.
Presented in part at the 93rd Annual Meeting of the American Ceramic Society, Cincinnati, OH, April 29, 1991 (Paper No. 2-SVIP–91).
Supported by the U.S. Department of Energy, Division of Materials Sciences, under Contract No. DEFG02–91ER–45439.
Publication History
- Issue published online: 11 JUL 2005
- Article first published online: 11 JUL 2005
- Manuscript No. 196721. Received May 9, 1991; approved October 22, 1991.
- Abstract
- References
- Cited By
Keywords:
- silicon carbide;
- aluminum nitride;
- microstructure;
- mechanical properties;
- solid solutions
A flexural strength of up to 1 GPa was achieved in SiC-AIN materials and is attributed to a dense, equiaxial grain structure of the 2H(δ) SiC-AIN solid solution, with a relatively uniform grain size of ∼ 1 μm. The strength was found to decrease with increasing grain size. While the β→α phase transformation and the formation of various metastable polytypes make microstructural control difficult in SiC materials, excellent control is facilitated in SiC-AIN materials as a result of the stable 2H solid solution. Several mechanisms of grain refinement during the β→ 2H transition were observed, most notably the direct formation of several 2H grains from a single β grain. In addition, grain growth is limited by the diffusion-controlled nature of the transition. These mechanisms could be utilized to achieve even higher strength values, with potentially higher reliability of the materials in structural applications.

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