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Keywords:

  • failure mechanisms;
  • fatigue crack growth (FCG);
  • polycrystalline superalloy;
  • scanning electron microscopy (SEM);
  • stress free activation energy;
  • temperature and frequency effects

ABSTRACT

A study is undertaken to investigate the fatigue crack growth rate properties of polycrystalline IN100 through the identification of crack growth mechanisms as a function of temperature, frequency and ΔK. An additional goal is to determine the stress free activation energy of IN100. Constant amplitude, load controlled tests are performed at room temperature (22 °C), 316 °C, 482 °C and 649 °C under two different loading frequencies of 20 and 0.33 Hz. These specimens are then analysed via scanning electron microscopy (SEM) to determine failure mechanisms. SEM shows that, as temperature increased from room temperature to 649 °C, the fracture mechanism transitions from transgranular to intergranular. The fracture mechanism is shown to transition from intergranular to transgranular at elevated temperatures as da/dN increases as a result of growing ΔK. Scanning electron microscopy shows that, as frequency decreases from 20 to 0.33 Hz at 649 °C, the fracture mechanism transitions from transgranular to intergranular.