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Fabrication of Three-Dimensionally Structured Titanium Oxide Thin Films by Transfer Printing

Authors

  • Jian-Hong Lee,

    1. Green Energy and Eco-Technology Center, Industrial Technology Research Institute, Tainan, Taiwan, R.O.C
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  • Shu-Yi Tsai,

    1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, R.O.C
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  • Wen-Jen Lee,

    1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, R.O.C
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  • Min-Hsiung Hon,

    1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, R.O.C
    2. Research Center for Energy Technology and Strategy, National Cheng Kung University, Tainan, Taiwan, R.O.C
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  • Ing-Chi Leu

    Corresponding author
    1. Department of Materials Science, National University of Tainan, Tainan, Taiwan, R.O.C
    • Green Energy and Eco-Technology Center, Industrial Technology Research Institute, Tainan, Taiwan, R.O.C
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  • The financial support received from the National Science Council, Taiwan, R.O.C., under grant NSC 99-2221-E-024-004 and NSC 97-2221-E-239-028, and that from the Industrial Technology Research Institute and the MoE ATU plan are greatly appreciated.

Author to whom correspondence should be addressed. e-mail: icleu@mail.mse.ncku.edu.tw

Abstract

The fabrication of a three-dimensionally structured metal oxide on various substrates mediated with self-assemble monolayer (SAM) Au-precoated substrates, such as Si wafer, non-planar glass, and flexible plastic, is important for a number of practical applications in electronics, photonics, and biotechnology. In this report, we describe the use of transfer printing for forming three-dimensionally structured TiO2 thin films with feature sizes of 10 μm in the diameter and 3 μm in height over areas of several square millimeters by direct patterning onto Si surfaces. This process is mediated by the presence of a 3-mercaptopropyltrimethoxysilane monolayer that guides the transfer of three-dimensionally structured TiO2 thin films from the low-energy surfaces of the mold to a Si substrate via surface forces.

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