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Bonding SiC to SiC Using a Sodium Silicate Solution


  • This work was supported in part by NASA contract number 00069955.



This paper describes a simple way to bond SiC parts with a bond thickness of <17 μm that produce shear strengths of several MPa using only a small amount of sodium silicate solution. Several SiC materials with different surface roughnesses were tested for the bonding process and a variety of tests (including thermally cycling the bond and cutting the bonded pieces) were performed to test the durability of the adhesion process. In this paper we explain the bonding procedure, discuss the bonding mechanism, and present shear strength results.