This article presents a low-loss fully embedded bandpass filter (BPF) using low-temperature co-fired ceramic (LTCC) for multilayer System-in-Package (SiP) and Multi-Chip-Module (MCM) applications, for example, wireless applications for the unlicensed 60 GHz band. Critical coupling gaps of conventional bandpass filters in this frequency range, which are not suitable for screen printing, could be eased by introducing coupling plates in adjacent layers. The four-layer BPF is designed for Du Pont's 9k7 LTCC system, and occupies a substrate area of 5.6 × 2.1 × 0.42 mm3 including transitions and a shielding via fence. The filter, including the two grounded coplanar waveguide transmission line (CPWg) to stripline transitions, has a measured insertion loss of 1.5 dB at the center frequency 58 GHz, and a return loss of less than −10 dB over the 11 GHz 3 dB passband.
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