An Experimental Approach to Enhance Cu Wire Bonding Yield Through Parameter Optimization
Version of Record online: 16 DEC 2011
© 2011, Society for Experimental Mechanics
Volume 38, Issue 3, pages 29–36, May/June 2014
How to Cite
Su, C.-T., Yeh, C.-J., Chou, C.-J. and Chang, C. A. (2014), An Experimental Approach to Enhance Cu Wire Bonding Yield Through Parameter Optimization. Experimental Techniques, 38: 29–36. doi: 10.1111/j.1747-1567.2011.00799.x
- Issue online: 23 APR 2014
- Version of Record online: 16 DEC 2011
- Received: June 23, 2011; accepted October 29, 2011
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