Impact of Infrared Finishing on the Mechanical and Sensorial Properties of Wheat Donuts
Article first published online: 13 AUG 2012
© 2012 Institute of Food Technologists®
Journal of Food Science
Volume 77, Issue 9, pages E224–E230, September 2012
How to Cite
Melito, H. S. and Farkas, B. E. (2012), Impact of Infrared Finishing on the Mechanical and Sensorial Properties of Wheat Donuts. Journal of Food Science, 77: E224–E230. doi: 10.1111/j.1750-3841.2012.02847.x
- Issue published online: 7 SEP 2012
- Article first published online: 13 AUG 2012
- MS 20111532 Submitted 12/22/2011, Accepted 6/8/2012.
- fat content;
Abstract: Infrared radiation may be used to simulate an immersion frying heat flux and create products with fried-like textures but lower fat contents. The objective of this study was to determine the process parameters needed to produce partially-fried, infrared-finished donuts comparable to fully-fried (control) donuts. A total of 8 different sets of infrared oven parameters (emitter height and belt speed) were tested. Instrumental analysis showed that all infrared-finished donuts had significantly (P≤ 0.05) lower fat content (25.6% to 30.6%) than the control (33.7%). Setting the infrared emitters in a height gradient from 70 to 50 mm or at a constant height of 60 mm above the belt produced donuts that were most instrumentally similar to the control. Infrared-finished donuts had comparable (P≤ 0.05) overall acceptance scores to the control, 5.28 to 5.85 versus 5.83, respectively. Infrared radiation may be used to finish-fry partially-fried donuts, yielding a product similar to a fully-fried donut but with significantly lower fat content.
Practical Applications: The partial-frying, infrared-finishing process detailed in this article may be used for other deep-fried foods. It is likely that these foods will also have a lower fat content when prepared with this process than when they are deep-fried. This process provides a method of lowering the fat content of fried foods without changing the food formulation.