Get access
Advertisement

Preparation of Nickel Ferrite–Copper Composite by Pressureless Infiltration

Authors


Authors to whom correspondence should be addressed. e-mails: zhoukc2@csu.edu.cn and lizhiyou@csu.edu.cn

Abstract

Pressureless infiltration was used to prepare a dense Cu/NiFe2O4–10NiO composite with interlocking microstructure. The results showed that the addition of Cu2O in Cu could improve the wettability between Cu and NiFe2O4. The metallic phase content and densification of the resulting composite were 34 wt% and 99.2%, respectively. The resulting composite had a flexural strength of 200 ± 20 MPa, a room-temperature thermal diffusivity of 0.12 cm2/s, and an electrical conductivity of 1503 S/cm at 900°C.

Get access to the full text of this article

Ancillary