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Numerical simulation of heat conduction in a random ballistic deposited grain aggregate

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Abstract

A numerical simulation of heat conduction in a grain aggregate is carried out to determine the packing fraction (the spatial fraction occupied by grains or 1-porosity) dependence of the thermal conductivity of the aggregate. Arrangements of grains are given by random ballistic deposition. It is found that the packing fraction dependence is well approximated by an exponential function. The number of contacts between grains is the crucial quantity in the conduction, and its packing fraction dependence is exponential. Heat conduction is found to be anisotropic, where the conduction along the deposition direction is more efficient than that perpendicular to the deposition direction.

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