Chris Yang, Hao Wu, Shreyes Melkote and Steven Danyluk Comparative Analysis of Fracture Strength of Slurry and Diamond Wire Sawn Multicrystalline Silicon Solar Wafers Advanced Engineering Materials 15
Fracture strength of mc-Si solar wafers and its spatial distribution within a wafer were studied. The slurry sawn wafers exhibit a gradual increase in fracture strength from wire entry to wire exit while the diamond sawn wafers show an anisotropic strength behavior relative to the bending orientation. The strength variation is attributed to surface and sub-surface defects from sawing processes.
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