E-mail a Wiley Online Library Link

Meirong Shi, Khaled Youssef and George A. Rozgonyi Fracture Strength of Photovoltaic Silicon Wafers Evaluated Using a Controlled Flaw Method Advanced Engineering Materials 15

Version of Record online: 25 APR 2013 | DOI: 10.1002/adem.201200312

Thumbnail image of graphical abstract

The impact of a single micro crack on the fracture strength of PV silicon wafer is investigated based on a controlled flaw method by introducing radial/median cracks with controllable scales through microindentation. Results indicate that the fracture strength of PV silicon wafer decreases linearly with the increasing of the microindentation load. It is also found that carbon plays an important role in the contact cracking-fracture process.

Complete the form below and we will send an e-mail message containing a link to the selected article on your behalf

Required = Required Field